Academic dean
Dean of Studies
by arrangement
several projects in the fields of surface analysis, thermal and electrical characterisation of new materials, >20 completed projects
Electronic Components, Scanning Probe Microscopy (SPM), Scanning Electron Microscopy (SEM) and Semiconductor Analytics
X-ray analytics (EDX, WDX), structure and microstructure analytics (EBSD), micro X-ray fluorescence (μ-XRF) scanning transmission electron microscopy (STEM), correlative microscopy
combined mechanical, magnetic, electric, thermal and chemical microcharacterisation
error and failure analytics, semiconductor wafer level tests and lifetime calculations
Present rank: Professor, Deggendorf Institute of Technology, 1998 Ph.D.: Technical University of Munich, 1994 University degree: Electrical Engineering, Technical University of Munich, 1989
1989-1994: Research assistant, Technical University of Munich 1994-1998: Siemens, IBM/Siemens/Toshiba DRAM – Project in Burlington, Vermont, USA 1998-present: Professor, Deggendorf Institute of Technology, Faculty of Electrical Engineering and Media Technology, Head of Institute for Quality and Materials Analysis (IQMA)
Associate Editor of Microelectronic Engineering (Elsevier)